IICIE Emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and ...

Earlier this spring, AMD, Broadcom, Meta Platforms, Microsoft, Nvidia, and OpenAI formed the Optical Compute Interconnect ...

RANOVUS’ standards compliant Odin® direct-drive CPO 2.0 optical interconnect, with 5pJ/bit energy efficiency, is best-in-class for co-packaged, near-packaged optics and pluggable module form factors ...

Driven by the rapid expansion of AI infrastructure, demand for Fiber Array Units (FAUs) and other passive optical components is increasing across silicon photonics and co-packaged optics (CPO) ...

Driven by growing AI demand, Lintes (TWSE: 6715) reported 17.2% YoY Q1 revenue growth and showcased its AI connectivity solutions at COMPUTEX 2026.Lintes has expanded its R&D since 2025 to fully ...

Co-packaged optics (CPO) means that optical and electronic devices are put in the same tiny package and work together. In traditional switches, the optical module is farther away from the switch chip, ...

Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64x400 Gbps or 32x800 Gbps pluggable optical transceiver modules.

TAIPEI, June 16, 2026 /PRNewswire/ -- ACON OPTICS (TWSE: 6820), a leading provider of advanced optical connectivity solutions, showcased its latest innovations in AI optical interconnect technologies ...

DIGITIMES notes that Arista Networks unveiled XPO at The Optical Fiber Communication Conference and Exhibition 2026 (OFC 2026). Unlike CPO, which is associated with more disruptive innovation, XPO ...