LONDON--(BUSINESS WIRE)--Process Systems Enterprise (PSE), a Siemens business, today released its rebranded gPROMS Process advanced process modelling environment. Formerly known as gPROMS ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

We test drive cars before we buy them, focus-group new products before we sell them, and try our food before we serve it. So, when it comes to capital expenditure (CapEx) projects in manufacturing, ...

For memory-intensive and high-performance computing, direct memory access (DMA) is indispensable. A typical DMA operation in PCI Express (PCIe) entails the transfer of data from the system memory to ...

As part of system development, many industries, including the automobile industry, make substantial use of modeling and simulation to help understand system performance. Modeling and simulation ...